THERMAL CHARACTERIZATION MEASUREMENT DEVICE AND THERMAL CHARACTERIZATION MEASUREMENT METHOD USING SAME

摘要

To provide a measurement device for estimating thermal characteristics by using a unidirectional heat flow steady state comparison method, which can measure a value of contact thermal resistance of an object to be measured, a value of thermal resistance and thermal conductivity and can applies an adequate thermal measurement and analysis technology by an interface pressure dependency of the object to be measured, a technique for thermal contact and a heat-transfer promoting effect, and has high reliability.;A measurement device 1 for estimating thermal characteristics comprises; a heat generating source unit 4 that has heat sensors 4g₁ and 4g₂ for detecting heat radiating toward a measurement sample unit 5, and that heats the measurement sample unit 5; the measurement sample unit 5; and a heat cooling source unit 6 that has heat sensors 6c₁ and 6c₂ for detecting heat radiating from the measurement sample unit 5, and that cools the measurement sample unit 5,wherein those units are sequentially stacked,the measurement sample unit 5 has a three-layer structure consisting of an object 5b to be measured for estimating thermal characteristics, and heat conducting materials 5a and 5c that sandwich the object,the heat conducting materials 5a and 5c are adhered to the heat generating source unit 4 and the heat cooling source unit 6 one another through a heat-transfer promoting agent therebetween,the object 5b to be measured for estimating thermal characteristics and the heat conducting materials 5a and 5c are adhered to one another through physical contact, chemical contact, and/or chemical bond contact.