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Fabrication and electrical characterization of MONOS memory with novel high-κ gate stack

机译:具有新型高κ栅堆叠的mONOs存储器的制作和电特性

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摘要

A novel high-κ gate stack structure with HfON/SiO 2 as dual tunneling layer (DTL), AIN as charge storage layer (CSL) and HfAIO as blocking layer (BL) is proposed to prepare the charge-trapping type of MONOS non-volatile memory device by employing in-situ sputtering method. The memory window, program/erase and retention properties are investigated and compared with similar gate stack structure with Si 3N 4/SiO 2 as DTL, HfO 2 as CSL and Al 2O 3 as BL. Results show a large memory window of 3.55 V at PIE voltage of +8 V/-I5 V, high program/erase speed and good retention characteristic can be achieved using the novel Au/ HfAIO/AIN/(HfON/SiO 2)/Si gate stack structure. The main mechanisms lie in the enhanced electron injection through the high-κ HfON/SiO 2 DTL, high trapping efficiency of the high-κ AIN material and effective blocking role of the high-κ HfAIO BL. ©2009 IEEE.
机译:提出了一种以HfON / SiO 2为双隧穿层(DTL),AlN为电荷存储层(CSL),HfAIO为阻挡层(BL)的新型高κ栅堆叠结构,以制备电荷俘获型的MONOS non-cell。易失性存储器件采用原位溅射法。研究了存储窗口,编程/擦除和保留特性,并与类似的栅堆叠结构进行了比较,其中Si 3N 4 / SiO 2为DTL,HfO 2为CSL,Al 2O 3为BL。结果显示,在PIE电压为+8 V / -I5 V时,存储窗口为3.55 V,使用新型Au / HfAIO / AIN /(HfON / SiO 2)/ Si可以实现较高的编程/擦除速度和良好的保留特性门堆叠结构。主要机制在于通过高κHfON / SiO 2 DTL增强电子注入,高κAIN材料的高俘获效率以及高κHfAIO BL的有效阻断作用。 ©2009 IEEE。

著录项

  • 作者

    Lai PT; Liu L; Xu JP; Chan CL;

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  • 年度 2009
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