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首页> 外文期刊>Synthetic Metals >Electrochemical cleavage of a Si-Si bond in poly[(tetraethyldisilanylene)oligo(2,5-thienylene)] films
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Electrochemical cleavage of a Si-Si bond in poly[(tetraethyldisilanylene)oligo(2,5-thienylene)] films

机译:聚[(四乙基二苯二甲撑)低聚(2,5-亚噻吩基)]薄膜中Si-Si键的电化学裂解

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摘要

Electrochemical stability of poly[(tetraethyldisilanylene)oligo(2,5-thienylene)] (DS mT; m refers to the number of thienylene units) films is investigated by means of in situ W-vis-NIR spectroscopy, in situ and ex situ fluorescence spectroscopy, gel-permeation chromatography, and FT-IR spectroscopy. It is found that a Si-Si bond in DSmT film with m = 3 to 5 is cleaved at potentials as low as 0.5 V versus Ag/Ag+ in acetonitrile, resulting in dissolution of oligothiophene-like species. The decomposed products are oxidized to form another polymer film on the surface of an original DSmT film and a doping reaction observed earlier takes place on the composite polymer film. (C) 1998 Elsevier Science S.A. All rights reserved. [References: 8]
机译:聚[(四乙基二亚硅烷基)低聚物(2,5-噻吩基)]的电化学稳定性(DS mT; m是指噻吩单元的数量)通过原位和原位W-vis-NIR光谱法进行研究荧光光谱,凝胶渗透色谱和FT-IR光谱。发现在m = 3至5的DSmT膜中的Si-Si键在相对于乙腈中的Ag / Ag +低至0.5V的电势下裂解,导致寡噻吩样物质溶解。分解的产物被氧化以在原始DSmT膜的表面上形成另一个聚合物膜,并且在复合聚合物膜上发生了较早观察到的掺杂反应。 (C)1998 Elsevier Science S.A.保留所有权利。 [参考:8]

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