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Design and characterization of micromachined sensor array integrated with CMOS based optical readout

机译:集成基于CMOS光学读出的微机械传感器阵列的设计与表征

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This paper reports a micro electro-mechanical system (MEMS) based sensor array integrated with CMOSbased optical readout. The integrated architecture has several unique features. MEMS devices are passive and there are no electrical connections to the MEMS sensor array. Thus, the architecture is scalable to large array formats for parallel measurement applications and can even be made as a disposable cartridge in the future using self-aligning features. A CMOS-based readout integrated circuit (ROIC) is integrated to the MEMS chip. Via holes are defined on ROIC by customized post-processing and MEMS chip is thinned down by a grinding process to enable integrated optical readout. A diffraction grating interferometerbased optical readout is realized by pixel-level illumination of the MEMS chip through the via holes and by capturing the reflected light using a photodetector array on the CMOS chip. A model for the optical readout principle has been developed using Fourier optics.
机译:本文报道了一种基于微机电系统(MEMS)的传感器阵列,该传感器阵列与基于CMOS的光学读出器集成在一起。集成架构具有几个独特的功能。 MEMS设备是无源的,并且没有与MEMS传感器阵列的电连接。因此,该架构可扩展至大阵列格式以用于并行测量应用,甚至将来可以使用自对准功能制成一次性墨盒。基于CMOS的读出集成电路(ROIC)被集成到MEMS芯片。通过定制的后处理在ROIC上定义通孔,并通过磨削工艺对MEMS芯片进行减薄以实现集成的光学读出。通过绕过通孔的MEMS芯片进行像素级照明,并使用CMOS芯片上的光电探测器阵列捕获反射光,即可实现基于衍射光栅干涉仪的光学读数。已经使用傅立叶光学系统开发了光学读出原理的模型。

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