Formation of cracks and nanometric films at the grain boundaries on wetting in the Cu-Bi system

摘要

Data from optical and Auger-electron spectroscopy on nanometric films at the grain boundaries in the Cu-Bi system show that the films arise as a result of Bi motion along cracks forming when liquid bismuth interacts with the grain boundary in copper, in the absence of external stress. The proportion of the boundary surface undergoing brittle failure is estimated. It is shown that bismuth is only present at such boundaries.