FORMING THE STRUCTURE OF A MATERIAL THAT IS SINTERED FROM GRANULAR COPPER CHIPS

摘要

We examine the mechanism of the interaction and sintering of the particles of the granulated copper chips in the course of their hot pressing at T = 300-450 deg C, p = 55-150 MPa. We identify with the use of the microstructural analysis and hydrostatic weighing methods and the evaluation of microhardness the nature of the forming of the structure and the variation of the properties of the finished articles as a function of the geometric characteristics and the initial state of the chip particles, the preliminary thermal treatments and the parameters of the hot pressing process. Recommendations are made for obtaining a product with the specified structural and quality characteristics.