An investigation into the influence of the composition and modes of thermal treatment on the structure and properties of rods and wire made of copper brands M1 and M0b following hot rolling and drawing at room temperature with degrees of reduction of about 95-99.99 percent is performed. The mechanical properties of the rods and wire at room temperature and higher temperatures, and the hardness, microhardness, and specific and residual electrical resistance in the state following deformation and subsequent thermal treatment are determined. It is established that impurities become separated from a solid copper solution at T = 400 - 600 deg C and that re-solution of the latter occurs at high annealing temperatures. The chilling point of MI copper wire from different stages of cold drawing is determined.
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