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Atomic scale deformation in the solid surface Induced by nanoparticle impacts

机译:纳米粒子撞击引起的固体表面原子尺度变形

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摘要

Nanoparticle impacts on an ultra-smooth surface always occur in nano-machining processes, such as polishing of a monocrystalline silicon wafer, which is an important process in the manufacture of semiconductors. A fundamental understanding of nanoparticle impacts on a solid surface is important to control and prevent the deformation of the surface. In this study, a cylindrical liquid jet containing de-ionized water and SiO_2 nanoparticles impacts obliquely on a single crystal silicon surface at a speed of 50 m s~(-1). The microstructure of the impacted surface was examined using a high resolution transmission electron microscope, an atomic force microscope, etc. Some crystal defects, lattice distortion, grain refinement and rotation of grains in the surface layer of the silicon wafer after exposure for 30 s have been observed. However, when the exposure time is extended to 10 min, an amorphous layer containing crystal grains is exhibited in the subsurface, and many craters, scratches and atom pileups can be found in the surface.
机译:纳米粒子对超光滑表面的冲击总是发生在纳米加工过程中,例如单晶硅晶片的抛光,这是半导体制造中的重要过程。对纳米颗粒撞击固体表面的基本理解对于控制和防止表面变形很重要。在这项研究中,包含去离子水和SiO_2纳米颗粒的圆柱状液体射流以50 m s〜(-1)的速度倾斜撞击在单晶硅表面上。使用高分辨率透射电子显微镜,原子力显微镜等检查了受冲击表面的微观结构。曝光30 s后,硅晶片表层的某些晶体缺陷,晶格畸变,晶粒细化和晶粒旋转具有被观察到。然而,当曝光时间延长至10分钟时,在表面下会出现一个包含晶粒的非晶层,并且在表面上会发现许多凹坑,划痕和原子堆积。

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