Dorn Creep Model and Finite Element Simulation of SnAgCu-CNT Solder Joints in FCBGA Device

摘要

With the addition CNTs, the properties of SnAgCu solders and solder joints can be improved remarkably. In this paper, based on the creep testing, the Dorn creep model was used to represent the creep behavior of SnAgCu-CNT solder, and the parameters were determined with the fitting analysis. Moreover, the Dorn creep model of SnAgCu and SnAgCu-CNT was incorporated into finite element code for calculating the creep strain response of solder joints in FCBGA (Flip Chip Ball Grid Array) device during thermal cycle loading. The results indicated that the CNTs can enhance the creep resistance of SnAgCu solder, which demonstrates the SnAgCu-CNT solders can replace the SnAgCu solder in electronic industry for high-reliability requirement.