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Very low-loss passive fiber-to-chip coupling with tapered fibers

机译:低损耗无源光纤到芯片的锥形光纤耦合

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摘要

A novel passive fiber-to-chip coupling based on the use of fiber tapers embedded in a guiding structure is proposed. By beam-propagation calculations it is verified that this new coupling method exhibits a very low insertion loss. Major advantages of the proposed method compared with butt coupling are demonstrated by simulation results: first, tolerance requirements for the fibers, e.g., diameter variations and core eccentricity, and for fabrication of the alignment structure are reduced by at least 1 order of magnitude. Second, coupling to waveguides of nearly arbitrary dimensions and refractive indices seems to be possible. Experimental results on thermal drawing of fiber tapers are presented and used as input data for the simulations. A concept for fabrication of the new coupling method with the Lithographic Galvanik Abformung (LIGA) technique is presented. # 1997 Optical Society of America
机译:提出了一种新型的无源光纤到芯片耦合,该光纤耦合是利用嵌入在引导结构中的光纤锥度实现的。通过光束传播计算,证实了这种新的耦合方法展现出非常低的插入损耗。仿真结果证明了该方法与对接耦合相比的主要优点:首先,对光纤的公差要求,例如直径变化和纤芯偏心度,以及对正结构的制造要求至少降低了一个数量级。其次,耦合到几乎任意尺寸和折射率的波导似乎是可能的。给出了纤维锥热拉伸实验结果,并将其用作模拟的输入数据。提出了利用光刻Galvanik Abformung(LIGA)技术制造新耦合方法的概念。 #1997美国眼镜学会

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