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首页> 外文期刊>Angewandte Chemie >Quantifying the Interdependence of Metal-Ligand Covalency and Bond Distance using Ligand K-edge XAS
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Quantifying the Interdependence of Metal-Ligand Covalency and Bond Distance using Ligand K-edge XAS

机译:使用配体K-Edge XA量化金属 - 配体共价和粘合距离的相互依存性

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摘要

Bond distance is a common structural metric used to assess changes in metal-ligand bonds, but it is not clear how sensitive changes in bond distances are with respect to changes in metal-ligand covalency. Here we report ligand K-edge XAS studies on Ni and Pd complexes containing different phosphorus(III) ligands. Despite the large number of electronic and structural permutations, P K-edge pre-edge peak intensities reveal a remarkable correlation that spectroscopically quantifies the linear interdependence of covalent M-P sigma bonding and bond distance. Cl K-edge studies conducted on many of the same Ni and Pd compounds revealed a poor correlation between M-Cl bond distance and covalency, but a strong correlation was established by analyzing Cl K-edge data for Ti complexes with a wider range of Ti-Cl bond distances. Together these results establish a quantitative framework to begin making more accurate assessments of metal-ligand covalency using bond distances from readily-available crystallographic data.
机译:粘合距离是用于评估金属配体键的变化的常见结构度量,但目前尚不清楚粘合距离对金属 - 配体共和等变化的敏感变化。在这里,我们在含有不同磷(III)配体的Ni和Pd复合物上报告配体K-Edge XAS研究。尽管电子和结构排列量大,但P k边缘预先边缘峰值强度揭示了光谱量化了共价M-P Sigma键合和键合距离的线性相互依赖性的显着相关性。在许多相同的Ni和Pd化合物上进行的Cl K-Edge研究显示了M-Cl键距离和共价之间的不良相关性,但是通过使用更广泛的Ti分析Ti复合物的Cl k边缘数据来建立强相关性-cl键距离。这些结果共同建立了使用来自易于可用的晶体数据的粘合距离开始更准确地评估金属 - 配体共和的定量框架。

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