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Reversible Covalent Stabilization of Stacking Contacts in DNA Assemblies

机译:DNA组件中堆叠接触的可逆共价稳定

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摘要

Stacking bonds formed between two blunt-ended DNA double helices can be used to reversibly stabilize higher-order complexes that are assembled from rigid DNA components. Typically, at low cation concentrations, stacking bonds break and thus higher-order complexes disassemble. Herein, we present a site-specific photochemical mechanism for the reversible covalent stabilization of stacking bonds in DNA assemblies. To this end, we modified one blunt end with the 3-cyanovinylcarbazole (K-cnv) moiety and positioned a thymine residue (T) at the other blunt end. In the bound state, the two blunt-ended helices are stacked together, resulting in a co-localization of K-cnv and T. Such a configuration induces the formation of a covalent bond across the stacking contact upon irradiation with 365 nm light. This bond can also be cleaved upon irradiation with 310 nm light, allowing repeated formation and cleavage of the same covalent bond on the timescale of seconds. Our system will expand the range of conditions under which stacking-bond-stabilized objects may be utilized.
机译:在两个钝端的DNA双螺旋之间形成的堆叠键可用于可逆地稳定从刚性DNA组分组装的高阶络合物。通常,在低阳离子浓度下,堆叠粘合粘合断裂,因此拆卸高阶复合物。在此,我们提出了一种特异性的光学化学机制,用于在DNA组件中的堆叠键的可逆性共价稳定。为此,我们用3-氰乙基咔唑(K-CNV)部分改性一个钝端,并将胸腺嘧啶残留物(T)定位在另一钝端。在绑定状态下,两个钝端螺旋堆叠在一起,导致K-CNV和T的共定位。这种配置在用365nm光照射时诱导穿过堆叠接触的共价键的形成。该键也可以在用310nm光照射时裂解,允许在秒秒的时间内反复形成和切割相同的共价键。我们的系统将扩展可以使用堆叠键稳定对象的条件范围。

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