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Annealing temperature influence on sol-gel processed zirconium oxide thin films for electronic applications

机译:退火温度对电子应用溶胶 - 凝胶加工氧化锆薄膜的影响

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摘要

A study of zirconium oxide (ZrO2) thin films obtained by the non-alkoxide sol-gel method at different annealing temperatures, up to 450 degrees C, is presented. Morphological, compositional, and optical characterizations of zirconia thin films show high transparency and high bandgap, besides homogeneous and non-porous surface. Metal insulating-metal (MIM) devices were assembled from this zirconia material for electrical characterizations and have shown high electric resistivity and high specific capacitance. A study of the thin film composition shows residues of S and Cl elements from the precursor solution that contributes for reduction of the dielectric constant of the zirconia thin films, even though they still present higher values when compared to SiO2, which is a positive alternative to replace this oxide in electronic devices. A parallel study of MIM assembled on polymeric substrate and annealed at 100 degrees C also leads to positive results concerning high electrical insulating and capacitance. This study aims the understanding of the relations between annealing temperature and impurities found in sol-gel based thin films, as well as their relations to dielectric characteristics of zirconia thin films that impact the final properties of electronic devices, such as in field effect transistors.
机译:提出了通过在不同退火温度下的非醇盐溶胶 - 凝胶法得到的氧化锆(ZrO2)薄膜,高达450℃。除了均匀和无孔的表面之外,氧化锆薄膜的形态学,组成和光学表征显示出高透明度和高带隙。金属绝缘金属(MIM)器件由该氧化锆材料组装用于电气特性,并显示出高电阻率和高比电容。薄膜组合物的研究表明了来自前体溶液的S和Cl元件的残基,这有助于降低氧化锆薄膜的介电常数,即使它们与SiO 2相比仍然较高,这是一个正替代方案更换电子设备中的氧化物。在聚合物基质上组装的MIM并在100℃下退火的平行研究也导致关于高电绝缘和电容的正结果。本研究旨在了解基于溶胶 - 凝胶的薄膜的退火温度和杂质之间的关系,以及它们与氧化锆薄膜的介电特性的关系,其影响电子器件的最终特性,例如场效应晶体管。

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