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Corrosion of copper in water free from molecular oxygen

机译:不含分子氧的水中铜的腐蚀

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The possibility of copper reacting with O_2-free water has been investigated by analysis of primary corrosion products, as well as by monitoring gas pressure change by time, in long term experiments for up to 6 months in a glove box environment. We establish hydrogen production, but being of the same magnitude irrespective whether copper is present or not. Although low, the hydrogen production rate is considerably larger than what would directly correspond to the amount of analysed copper oxidation products. Our analyses encompass the changes to the surface cleaned copper (99.9999%), the water phase and the Duran glass in contact with the water (ppt quality). We have used very sensitive methods (XPS, AES, ICP-MS, XRF) while keeping contamination risks to a minimum. We conclude that the oxidation rate of copper is very low, yielding only parts of a monolayer of Cu_2O after 6 months of exposure at 50℃ together with an accompanying very low concentration of copper species (4-5 μg L~(-1)) in the water phase.
机译:在手套箱环境中长达6个月的长期实验中,通过分析主要腐蚀产物以及随时间监测气压变化,研究了铜与不含O_2的水发生反应的可能性。我们确定氢的产生,但是无论是否存在铜,其产量都相同。氢气的生成率虽然很低,但比直接对应于分析的铜氧化产物的数量大得多。我们的分析包括表面清洁铜(99.9999%),水相和与水接触的Duran玻璃(ppt质量)的变化。我们使用了非常敏感的方法(XPS,AES,ICP-MS,XRF),同时将污染风险降至最低。我们得出的结论是,铜的氧化速率非常低,在50℃下暴露6个月后仅产生部分Cu_2O单层,同时伴随着极低浓度的铜物种(4-5μgL〜(-1))在水相中。

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