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Broad-spectrum enhancement of polymer composite dielectric constant at ultralow volume fractions of silica-supported copper nanoparticles

机译:二氧化硅负载的铜纳米颗粒超低体积分数时聚合物复合介电常数的广谱增强

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摘要

A new strategy for the synthesis of high permittivity polymer composites is demonstrated based on well-defined spatial distribution of ultralow amounts of conductive nanoparticles. The spatial distribution was realized by immobilizing Cu nanoparticles within the pore system of silica microspheres, preventing direct contact between individual Cu particles. Both Cu-loaded and unloaded silica microspheres were then used as fillers in polymer composites prepared with thermoplastic SEBS rubber as the matrix. With a metallic Cu content of about 0.26 vol % in the composite, a relative increase of 94% in real permittivity was obtained. No Cu-induced relaxations were observed in the dielectric spectrum within the studied frequency range of 0.1 Hz to 1 MHz. When related to the amount of conductive nanoparticles, the obtained composites achieve the highest broad-spectrum enhancement of permittivity ever reported for a polymer-based composite.
机译:基于超低量导电纳米粒子的明确定义的空间分布,展示了一种合成高介电常数聚合物复合材料的新策略。通过将铜纳米颗粒固定在二氧化硅微球的孔系统中来实现空间分布,从而防止单个铜颗粒之间的直接接触。然后将负载有铜和没有负载的二氧化硅微球都用作以热塑性SEBS橡胶为基质制备的聚合物复合材料的填料。在复合物中金属Cu含量为约0.26vol%时,实际介电常数相对增加了94%。在研究的0.1 Hz至1 MHz的频率范围内,在介电谱中未观察到Cu引起的弛豫。当与导电纳米颗粒的量相关时,所获得的复合材料实现了有报道的基于聚合物的复合材料的最高介电常数的广谱增强。

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