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Halogen-bonding mediated stepwise assembly of gold nanoparticles onto planar surfaces

机译:卤素键介导的金纳米颗粒在平面表面上的逐步组装

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In this study halogen bonding (XB) is used as the driving force for the noncovalent assembly of gold nanoparticles (AuNPs) on silicon and quartz substrates functionalized with organic monolayers. The AuNPs are functionalized with XB-donor ligands, whereas the monolayers have pyridine groups as XB-acceptors. The surface-confined systems are formed by iteratively exposing the monolayers to solutions of organic cross-linkers having 2-4 pyridine groups and functionalized AuNPs. UV-vis spectroscopy, atomic force microscopy (AFM), and scanning electron microscopy (SEM) reveal how the structure of the resulting surface-bound assemblies are controlled by (i) the properties of the monolayers, (ii) the molecular structure and the number of XB binding sites of the organic cross-linker, and (iii) the number of functionalized AuNP and cross-linker deposition steps. Moreover, these structures exhibit surface-enhanced Raman scattering and significant changes are observed in the morphology of some of the surface-bound assemblies upon aging.
机译:在这项研究中,卤素键(XB)被用作金纳米颗粒(AuNPs)在有机单层功能化的硅和石英基板上非共价组装的驱动力。 AuNP被XB-供体配体官能化,而单层具有吡啶基作为XB-受体。通过将单层迭代地暴露于具有2-4个吡啶基团和官能化AuNP的有机交联剂溶液中来形成表面受限系统。紫外可见光谱,原子力显微镜(AFM)和扫描电子显微镜(SEM)揭示了如何通过(i)单层的特性,(ii)分子结构和分子结构来控制所得表面结合组装体的结构。有机交联剂XB结合位点的数量,以及(iii)功能化AuNP和交联剂沉积步骤的数量。而且,这些结构表现出表面增强的拉曼散射,并且在老化后观察到一些表面结合的组件的形态发生了显着变化。

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