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Measuring glassy and viscoelastic polymer flow in molecular-scale gaps using a flat punch mechanical probe

机译:使用平冲机械探针在分子级间隙中测量玻璃状和粘弹性聚合物的流动

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This paper investigates molecular-scale polymer mechanical deformation during large-strain squeeze flow of polystyrene (PS) films, where the squeeze flow gap is dose to the polymer radius of gyration (R_g). Stress - strain and creep relations were measured during flat punch indentation from an initial film thickness of 170 nm to a residual film thickness of 10 nm in the PS films, varying molecular weight (M_w) and deformation stress rate by over 2 orders of magnitude while temperatures ranged from 20 to 125 °C. In stress - strain curves exhibiting an elastic-to-plastic yield-like knee, the response was independent of M_w, as expected from bulk theory for glassy polymers. At high temperatures and long times sufficient to extinguish the yield-knee, the mechanical response M_w degeneracy was broken, but no molecular confinement effects were observed during thinning. Creep measurements in films of 44K M_w were well-approximated by bulk Newtonian no-slip flow predictions. For extrusions down to a film thickness of 10 nm, the mechanical relaxation in these polymer films scaled with temperature similar to Williams - Landel - Ferry scaling in bulk polymer. Films of 9000K M_w, extruded from an initial film thickness of 2R_g to a residual film thickness of 0.5R_g, while showing stress-strain viscoelastic response similar to that of films of 900K M_w, suggestive of shear-thinning behavior, could not be matched to a constitutive flow model. In general, loading rate and magnitude influenced subsequent creep extrusion depth of high-M_w, films, with deeper final extrusions for high loading rates than for low leading rates. The measurements suggest that, for high-resolution nanoimprint lithography, mold flash or final residual film thickness can be reduced for high strain and strain rate loading of high-M_w thin films.
机译:本文研究了聚苯乙烯(PS)薄膜大应变挤压流动过程中的分子尺度聚合物机械变形,其中挤压流动间隙与聚合物旋转半径(R_g)成正比。在平板冲头压痕过程中,从PS膜的初始膜厚为170 nm到残留膜厚度为10 nm,改变了分子量(M_w)和变形应力率超过2个数量级,同时测量了应力-应变和蠕变关系。温度范围为20至125°C。如玻璃态聚合物的体积理论所预期的那样,在应力-应变曲线表现出弹性至塑性的屈服状弯曲时,响应独立于M_w。在足以消除屈服屈膝的高温和长时间下,机械响应M_w简并性被破坏,但在稀疏过程中未观察到分子限制作用。大量牛顿无滑流预测值很好地近似了44K M_w薄膜中的蠕变测量值。对于低至10 nm薄膜厚度的挤出,这些聚合物薄膜的机械松弛随温度变化而变化,这类似于本体聚合物中的Williams-Landel-Ferry结垢。从初始膜厚2R_g挤出到残余膜厚0.5R_g的9000K M_w膜,显示出与900K M_w膜相似的应力应变粘弹性响应,表明剪切变稀行为,无法与本构模型。通常,加载速率和强度会影响高M_w薄膜的后续蠕变挤出深度,对于高加载速率而言,最终挤出的深度要比对低引导速率的挤出要深。测量结果表明,对于高分辨率纳米压印光刻,对于高M_w薄膜的高应变和应变速率加载,可以减少铸模毛刺或最终残留膜厚度。

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