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Soldering of Carbon Materials Using Transition Metal Rich Alloys

机译:使用富含过渡金属的合金焊接碳材料

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Joining of carbon materials via soldering has not been possible up to now due to lack of wetting of carbons by metals at standard soldering temperatures. This issue has been a severely restricting factor for many potential electrical/electronic and mechanical applications of nanostructured and conventional carbon materials. Here we demonstrate the formation of alloys that enable soldering of these structures. By addition of several percent (2.5-5%) of transition metal such as chromium or nickel to a standard lead-free soldering tin based alloy we obtained a solder that can be applied using a commercial soldering iron at typical soldering temperatures of approximately 350 degrees C and at ambient conditions. The use of this solder enables the formation of mechanically strong and electrically conductive joints between carbon materials and, when supported by a simple two-step technique, can successfully bond carbon structures to any metal terminal. It has been shown using optical and scanning electron microscope images as well as X-ray diffraction patterns and energy dispersive X-ray mapping that the successful formation of carbon solder bonds is possible, first, thanks to the uniform nonreactive dispersion of transition metals in the tin-based matrix. Further, during the soldering process, these free elements diffuse into the carbon alloy border with no formation of brazing-like carbides, which would damage the surface of the carbon materials.
机译:到目前为止,由于在标准焊接温度下金属对碳的润湿性不足,目前尚无法通过钎焊连接碳材料。对于许多潜在的纳米结构和常规碳材料的电气/电子和机械应用,此问题已成为严重的限制因素。在这里,我们演示了能够焊接这些结构的合金的形成。通过将百分之几(2.5%到5%)的过渡金属(例如铬或镍)添加到标准的无铅锡基合金中,我们可以得到一种可以使用商业烙铁在大约350度的典型焊接温度下使用的焊料C和在环境条件下。使用这种焊料可以在碳材料之间形成机械牢固且导电的接头,并且当通过简单的两步技术进行支撑时,可以成功地将碳结构键合到任何金属端子上。使用光学和扫描电子显微镜图像以及X射线衍射图和能量色散X射线图表明,成功地形成碳焊剂是可能的,首先,这要归功于过渡金属在反应堆中的均匀非反应性分散。锡基矩阵。此外,在焊接过程中,这些自由元素扩散到碳合金边界中,而没有形成类似钎焊的碳化物,这会损坏碳材料的表面。

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