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Electronic Structure of the Dark Surface of the Weak Topological Insulator Bi14Rh3I9

机译:弱拓扑绝缘子Bi14Rh3I9的黑暗表面的电子结构

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Compound Bi14Rh3I9 consists of ionic stacks of intermetallic [(Bi4Rh)(3)I](2+) and insulating [Bi2I8](2-) layers and has been identified to be a weak topological insulator. Scanning tunneling microscopy revealed the robust edge states at all step edges of the cationic layer as a topological fingerprint. However, these edge states are found 0.25 eV below the Fermi level, which is an obstacle for transport experiments. Here, we address this obstacle by comparing results of density functional slab calculations with scanning tunneling spectroscopy and angle-resolved photoemission spectroscopy. We show that the n-type doping of the intermetallic layer is intrinsically caused by the polar surface and is well-screened toward the bulk. In contrast, the anionic "spacer" layer shows a gap at the Fermi level, both on the surface and in the bulk; that is, it is not surface-doped due to iodine desorption. The well-screened surface dipole implies that a buried edge state, probably already below a single spacer layer, is located at the Fermi level. Consequently, a multilayer step covered by a spacer layer could provide access to the transport properties of the topological edge states. In addition, we find a lateral electronic modulation of the topologically nontrivial surface layer, which is traced back to the coupling with the underlying zigzag chain structure of the spacer layer.
机译:化合物Bi14Rh3I9由金属间化合物[(Bi4Rh)(3)I](2+)和绝缘性[Bi2I8](2-)层组成的离子堆叠,已被确定为弱拓扑绝缘体。扫描隧道显微镜显示在阳离子层的所有台阶边缘处的稳健边缘状态作为拓扑指纹。但是,发现这些边缘状态比费米能级低0.25 eV,这是运输实验的障碍。在这里,我们通过比较密度泛函平板计算结果与扫描隧道光谱和角度分辨光发射光谱来解决这一障碍。我们表明,金属间化合物层的n型掺杂本质上是由极性表面引起的,并且朝着整体方向进行了良好的筛选。相反,阴离子“间隔物”层在费米能级上在表面和整体上都显示出一个间隙。也就是说,由于碘的解吸,它不是表面掺杂的。经过充分筛选的表面偶极子意味着可能已经在单个隔离层下面的掩埋边缘状态位于费米能级。因此,由间隔层覆盖的多层步骤可以提供对拓扑边缘状态的传输特性的访问。此外,我们发现了拓扑非平凡的表面层的横向电子调制,其可追溯到与间隔层的基础之字形链结构耦合。

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