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首页> 外文期刊>ACS nano >Reversible Semiconducting-to-Metallic Phase Transition in Chemical Vapor Deposition Grown Mono layer WSe2 and Applications for Devices
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Reversible Semiconducting-to-Metallic Phase Transition in Chemical Vapor Deposition Grown Mono layer WSe2 and Applications for Devices

机译:化学气相沉积生长的单层WSe2中可逆的半导体到金属的相变及其在设备中的应用

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Two-dimensional (2D) semiconducting monolayer transition metal dichalcogenides (TMDCs) have stimulated lots of interest because they are direct bandgap materials that have reasonably good mobility values. However, contact between most metals and semiconducting TMDCs like 2H phase WSe2 are highly resistive, thus degrading the performance of field effect transistors (FETs) fabricated with WSe2 as active channel materials. Recently, a phase engineering concept of 2D MoS2 materials was developed, with improved device performance. Here, we applied this method to chemical vapor deposition (CVD) grown monolayer 2H-WSe2 and demonstrated semiconducting-to-metallic phase transition in atomically thin WSe2. We have also shown that metallic phase WSe2 can be converted back to semiconducting phase, demonstrating the reversibility of this phase transition. In addition, we fabricated FETs based on these CVD-grown WSe2 flakes with phase-engineered metallic 1T-WSe2 as contact regions and intact semiconducting 2H-WSe2 as active channel materials. The device performance is substantially improved with metallic phase source/drain electrodes, showing on/off current ratios of 10(7) and mobilities up to 66 cm(2)/V.s for monolayer WSe2. These results further suggest that phase engineering can be a generic strategy to improve device performance for many kinds of 2D TMDC materials.
机译:二维(2D)半导体单层过渡金属二硫化碳(TMDC)引起了很多关注,因为它们是具有合理良好迁移率值的直接带隙材料。但是,大多数金属与半导电TMDC(例如2H相WSe2)之间的接触具有高电阻,因此会降低以WSe2作为有源沟道材料制造的场效应晶体管(FET)的性能。最近,人们开发了具有2D MoS2材料的相工程概念,并改善了器件性能。在这里,我们将此方法应用于化学气相沉积(CVD)生长的单层2H-WSe2,并证明了原子薄WSe2中的半导体到金属的相变。我们还表明,金属相WSe2可以转换回半导体相,证明了这种相变的可逆性。另外,我们基于这些CVD生长的WSe2薄片制造了FET,并以相工程金属1T-WSe2作为接触区域,完整的半导体2H-WSe2作为有源沟道材料。金属相源/漏电极可显着改善设备性能,单层WSe2的开/关电流比为10(7),迁移率高达66 cm(2)/V.s。这些结果进一步表明,相工程可以是提高多种2D TMDC材料的器件性能的通用策略。

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