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Electrified Au Nanoparticle Sponges with Controlled Hydrophilic/Hydrophobic Properties

机译:亲水/疏水特性可控的电化金纳米海绵

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Molecularly imprinted Au nanoparticle (NP) composites for the selective binding of the electron acceptors N,N′-dimethyl-4,4′-bipyridinium, MV~(2+) (1), or bis-N-methylpyridinium-4,4′-ethylene, BPE~(2+) (2), are prepared by the electropolymerization of thioaniline-functionalized Au NPs in the presence of the electron acceptor molecules and the subsequent rinsing off of the imprint substrates. The electrochemical oxidation of the π-donor bisaniline units bridging the Au NPs yields the quinoid electron acceptor bridges, which are re-reduced to the bisaniline state. By the cyclic oxidation and reduction of the bridging units, they are reversibly switched between the π-acceptor and the π-donor states, thus allowing the electrochemically triggered uptake and release of the electron acceptors (1 or 2) to and from the imprinted sites. While the electron acceptors 1 or 2 bind to the imprinted sites via donor?acceptor interactions, these substrates are released from the Au NP matrices upon the oxidation of the bridges to the quinoid state. The electrochemically switched wettability of the imprinted composites is demonstrated upon the reversible uptake, or release, of the substrates to and from the matrices. While the association of 1 or 2 to the respectively imprinted composites generates hydrophilic surfaces (θ = 30 and 41°, respectively), the release of the substrates from the matrices yields surfaces of enhanced hydrophobicity (θ = 60 and 55°, respectively). The electrochemically switched wettability is selective to the imprinted substrates and is amplified in the presence of the imprinted matrices as compared to the non-imprinted composites. The association of MV2+ or BPE2+ to the imprinted sites is further electrochemically characterized.
机译:分子印迹金纳米颗粒(NP)复合材料,用于电子受体N,N'-二甲基-4,4'-联吡啶,MV〜(2+)(1)或bis-N-甲基吡啶-4,4的选择性结合通过在电子受体分子的存在下将硫代苯胺官能化的Au NPs电聚合并随后冲洗掉压印基材,可以制备BPE〜(2+)(2)-乙烯。桥接Au NPs的π供体双苯胺单元的电化学氧化产生了醌型电子受体桥,该桥被还原为双苯胺状态。通过桥接单元的循环氧化和还原,它们可在π受体和π受体状态之间可逆地切换,从而允许电化学触发的电子受体(1或2)进入和释放出印迹位点。当电子受体1或2通过供体-受体相互作用与印迹位点结合时,这些基片在电桥氧化为醌型后从Au NP基质释放出来。在基材与基质之间可逆地吸收或释放时,证明了印迹复合材料的电化学转换润湿性。虽然1或2与分别印记的复合物的缔合会产生亲水表面(分别为θ= 30和41°),但基材从基质中的释放会产生疏水性增强的表面(分别为θ= 60和55°)。与未压印的复合材料相比,电化学转换的润湿性对压印的基材具有选择性,并且在压印的基质存在下被放大。 MV2 +或BPE2 +与印迹位点的缔合进一步进行了电化学表征。

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