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Implantation Length and Thermal Stability of Interstitial Ar Atoms in Boron Nitride Nanotents

机译:氮化硼纳米帐篷中间隙原子的注入长度和热稳定性

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摘要

Hyperthermal atoms may be implanted beneath single layers of graphene or hexagonal boron nitride (h-BN) on a substrate. For the case of h-BN on rhodium, which is a corrugated honeycomb superstructure with a periodicity of 3.2 nm, Ar atoms are implanted at distinct interstitial sites within the supercell, where the h-BN is weakly bound to the substrate. These peculiar structures are reminiscent of "nanotents" with an ultimately thin "rainfly". Here we explore the implantation length (i.e., the distance the atoms move before they come to rest as interstitial defects) and the thermal stability of these atomic agglomerates above room temperature. The results are obtained by variable-temperature scanning tunneling microscopy and density functional theory calculations.
机译:可以将高温原子植入衬底上的单层石墨烯或六方氮化硼(h-BN)下。对于铑为h-BN的情况,它是周期为3.2 nm的波纹状蜂窝状上部结构,将Ar原子注入到超级电池内不同的间隙位置,其中h-BN弱结合到基底上。这些奇特的结构使人联想到带有最终薄的“雨蝇”的“ nanotents”。在这里,我们探讨了注入长度(即原子在作为间隙缺陷而停下来之前移动的距离)以及这些原子团聚在室温以上的热稳定性。通过变温扫描隧道显微镜和密度泛函理论计算获得结果。

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