Effects of device structure on thermo-optic switch and design optimization

摘要

The study on reliability of multi-layer structure of thermo-optic switch under thermal mechanical coupling effect is the basic research subject in modern micro-optoelectronics. Power consumption and response time are the most important performance indexes. Based on the generalized thermoelasticity theory, thermo-optic switch models of various structures are built to simulate the temperature and stress field for structure optimization. The numerical results show that an appropriate cross-section shape can reduce the switch power consumption without prejudice to the response speed, the refractive index of the core layer varies with the temperature, and the interlayer thermal mismatching stress of the double-ridge structure is the maximum. The above findings will introduce new ideas for research and development and design of new optic switches.