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XPS study of graphene oxide reduction induced by (100) and (111)-oriented Si substrates

机译:XPS研究(100)和(111)的Si衬底诱导的石墨烯氧化物还原研究

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摘要

The reduction of graphene oxide (GO) has been extensively studied in literature in order to let GO partially recover the properties of graphene. Most of the techniques proposed to reduce GO are based on high temperature annealing or chemical reduction. A new procedure, based on the direct reduction of GO by etched Si substrate, was recently proposed in literature. In the present work, we accurately investigated the Si-GO interaction with x-ray photoelectron spectroscopy. In order to avoid external substrate oxidation factors we used EtOH as the GO solvent instead of water, and thermal annealing was carried out in UHV. We investigated the effect of Si(100), Si(111) and Au substrates on GO, to probe the role played by both the substrate composition and substrate orientation during the reduction process. A similar degree of GO reduction was observed for all samples but only after thermal annealing, ruling out the direct reduction effect of the substrate.
机译:在文献中广泛研究了石墨烯氧化物(GO)的还原,以便放弃部分恢复石墨烯的性质。 提出减少去的大部分技术都基于高温退火或化学还原。 最近在文献中提出了一种基于蚀刻Si衬底的直接减少的新程序。 在本工作中,我们准确地研究了与X射线光电子能谱的Si-Go相互作用。 为了避免外部衬底氧化因子,我们使用EtOH作为去溶剂而不是水,并且在UHV中进行热退火。 我们研究了Si(100),Si(111)和Au基材的作用,以探测在还原过程期间衬底组合物和基材取向的作用。 对于所有样品,观察到类似程度的降低,但仅在热退火后,统治基板的直接减少效果。

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