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On the sintering of solution-based silver nanoparticle thin-films for sprayed and flexible antennas

机译:在喷涂和柔性天线的溶液基银纳米粒子薄膜的烧结

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摘要

In this work, we report on the fabrication and characterization of sub-300 nm electrode films based on solution-processed silver nanoparticles (AgNPs). Following the deposition of the electrode material using a scalable and homogenous spray process, the films are treated with thermal or photonic sintering to promote the coalescence of the nanoparticles and in turn decrease the resistivity of the films. After sintering, a resistivity of 63 +/- 13 n Omega m is achieved for the AgNP films, which is only by a factor of four larger than the literature value for bulk silver. Both post-deposition treatments show a similar performance with regard to the achieved resistivity. However, photonic sintering avoids the need for thermal annealing at substrate temperatures of 150 degrees C and above. In addition, the photonic sintering process can easily be embedded in a roll-to-roll process and is extremely fast with light exposure times below 3 ms. Thus, this manufacturing technique paves the way for the use of flexible substrates in electronics. As a simple and practical application, we present the use of AgNP films for antennas operating in the 5 GHz band on flexible polyethylene terephthalate substrate. An original coplanar design is employed for the fabrication of antennas with a single conductive layer that exhibit a maximum return loss and radiation of -27 dB and 95%, respectively.
机译:在这项工作中,我们报告了基于溶液加工银纳米颗粒(AgNP)的300nm电极膜的制造和表征。在使用可伸缩和均匀的喷雾过程沉积电极材料之后,用热量或光子烧结处理膜以促进纳米颗粒的聚结,然后降低薄膜的电阻率。在烧结之后,对AGNP薄膜实现63 +/-13n OMega M的电阻率,这仅是比散装银的文献值大的四倍。沉积后处理均显示出在实现的电阻率方面具有类似的性能。然而,光子烧结避免了在150℃和更高的衬底温度下热退火的需要。另外,光子烧结过程可以容易地嵌入卷到辊的过程中,并且极快地具有低于3ms的光曝光时间。因此,该制造技术铺平了在电子设备中使用柔性基板的方式。作为一种简单实用的应用,我们介绍了在柔性聚对苯二甲酸乙二醇酯基材上的5 GHz带中操作的AGNP薄膜。原始的共面设计用于制造天线,单个导电层分别表现出最大返回损耗和辐射的-27dB和95%。

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