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Contact engineering high-performance ambipolar multilayer tellurium transistors

机译:联系工程高性能Ambipolar多层碲晶体管

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Multilayer Te nanosheets have attracted increasing attention due to their high-performance electronic transport properties and good air-stability. Theoretical simulation suggests that the electronic properties of multilayer Te nanosheets could be effectively modulated by contact engineering, but most studies have reported p-type multilayer Te devices. Here, for the first time, we report on high performance ambipolar multilayer Te filed-effect-transistors (FETs) with low work function scandium (Sc, 3.58 eV), demonstrating high mobilities of 489 and 648 cm(2)V(-1)s(-1) for electron and hole transport, respectively. Multilayer Te FETs with large work function metals, such as chromium (Cr, 4.5 eV), show a typical p-type transport behavior. The band structure of multilayer Te with a small bandgap and low work function Sc result in a small contact resistance (R-c) for both of electron and hole transport, which leads to the ambipolar behavior of multilayer Te nanosheets. The ambipolar behavior of multilayer Te FETs indicates that contact engineering is a valid tool to tune the electrical properties of multilayer Te and raises the possibility of designing digital circuits based on multilayer Te.
机译:由于其高性能的电子传输性能和良好的空气稳定性,多层TE纳米片引起了不断的关注。理论仿真表明,通过联系工程可以有效地调节多层TE纳米电池的电子特性,但大多数研究报告了P型多层TE器件。在这里,我们首次报告具有低功函数钪(SC,3.58eV)的高性能Ambolar Multidayer TE归档晶体管(FET),展示了489和648cm(2)V(-1)的高迁移率用于电子和空穴传输的S(-1)。具有大型工作功能金属的多层TE FET,如铬(CR,4.5eV),显示出典型的P型传输行为。具有小带隙和低功函数SC的多层TE的带结构,导致电子和空穴传输两者的小接触电阻(R-C),这导致多层TE NanosheS的Ambolar行为。多层TE FET的Ambolar行为表明,联系工程是调整多层TE的电气特性的有效工具,并提高基于多层TE设计数字电路的可能性。

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