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Preparation and conductive property of Cu coatings and Cu-graphene composite coatings on ABS substrate

机译:ABS基材Cu涂层和Cu-石墨烯复合涂层的制备及导电性能

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摘要

A facile, low-cost and environmentally-friendly technique has been developed to prepare highly conductive copper-graphene nanosheet (Cu-GNS) composite coatings on ABS (Acrylonitrile-Butadiene-Styrene) substrate. The surface activation of ABS substrate was obtained by a chrome-free and palladium-free pretreatment consisting of molecular bonding. Before electroplating Cu, the homogeneous single Ag film on ABS surface was achieved by the electroless spray-plating process. In addition, the deposition of Cu and GNS increased in the coatings along with the current density increasing. Four-point-probe test confirmed that the resistivity of Cu coatings (0.08 m Omega mm) and Cu-GNS composite coatings (0.05 m Omega mm) was in the same order of magnitude as pure copper (0.0175 m Omega mm) at high current density. Meanwhile, comparing with the Cu coatings, the resistivity of Cu-GNS composite coatings was reduced by nearly 40% at the same current density. The conductive property was significantly improved owing to the deposition of GNS. Therefore, this work was expected to expand the method of polymer materials surface metallization.
机译:已经开发了一种容易,低成本和环保的技术,用于在ABS(丙烯腈 - 丁二烯 - 苯乙烯)基材上制备高导电铜 - 石墨烯纳米片(Cu-GNS)复合涂层。通过由分子键组成的无铬和无钯的预处理获得ABS底物的表面活化。在电镀Cu之前,通过无电光镀工艺实现ABS表面上的均匀单缩合膜。另外,Cu和GNS的沉积在涂层中增加以及电流密度增加。四点探针测试证实,Cu涂层(0.08MΩmm)和Cu-GNS复合涂层(0.05MΩmm)的电阻率在高电流下与纯铜(0.0175MΩ0mm)相同的数量级密度。同时,与Cu涂层相比,Cu-GNS复合涂层的电阻率降低了相同电流密度的近40%。由于GNS的沉积,导电性能显着提高。因此,预计这项工作会扩大聚合物材料表面金属化的方法。

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