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Thermal rectification and interfacial thermal resistance in hybrid pillared-graphene and graphene: a molecular dynamics and continuum approach

机译:杂交柱 - 石墨烯和石墨烯中的热整流和界面热阻:分子动力学和连续性方法

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摘要

We investigate thermal rectification and thermal resistance in a hybrid pillared-graphene and graphene (PGG) system by both molecular dynamics (MD) simulation and a continuum model. First, the thermal conductivity of both pillared-graphene and graphene is calculated by employing MD simulation and Fourier's law. Our results show that the thermal conductivity of the pillared-graphene is much smaller than that of graphene by one order of magnitude. Next, by applying positive and negative temperature gradients along the longitudinal direction of the PGG, the thermal rectification is examined. The MD results indicate that for the lengths in the range of 3686 nm, the thermal rectification remains almost constant (similar to 3%-5%). We have also studied the phonon density of states (DOS) on both sides of the interface of PGG. The DOS curves show that there is phonon scattering at low frequencies that depends on the imposed temperature gradient direction in the system. Therefore, we can introduce the PGG as a thermal rectifier at room temperature. Furthermore, next, we also explore the temperature distribution over the PGG by using the continuum model. The results obtained from the continuum model predict the MD results, such as the temperature distribution in the upper half-layer and lower full-layer graphene, the temperature gap, and also the thermal resistance at the interface. This study could help in the design of chip coolers, and phononic devices such as thermal nanodiodes.
机译:我们通过分子动力学(MD)模拟和连续模型来研究混合柱 - 石墨烯和石墨烯(PGG)系统中的热整流和热阻。首先,通过采用MD仿真和傅立叶定律来计算柱状 - 石墨烯和石墨烯的导热率。我们的结果表明,柱状 - 石墨烯的导热率远小于石墨烯的一个级别。接下来,通过沿PGG的纵向施加正温度梯度,检查热整流。 MD结果表明,对于3686nm的长度,热整流几乎恒定(类似于3%-5%)。我们还研究了PGG界面两侧的状态(DOS)的声子密度。 DOS曲线表明,在低频下存在声子散射,这取决于系统中施加的温度梯度方向。因此,我们可以在室温下将PGG作为热整流器介绍。此外,接下来,我们还通过使用连续体模型来探讨PGG的温度分布。从连续模型获得的结果预测了MD结果,例如上半层和下全层石墨烯,温度间隙以及界面的热阻的温度分布。本研究可以帮助芯片冷却器的设计和诸如热纳米二极管的函音装置。

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