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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >The influence of the copperickel ratio on the electrochemical behavior of Cu-Ni alloys in acidic sulfate solutions
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The influence of the copperickel ratio on the electrochemical behavior of Cu-Ni alloys in acidic sulfate solutions

机译:铜镍比对酸性硫酸盐溶液中铜镍合金电化学行为的影响

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摘要

The electrochemical behavior of Cu-Ni alloys with different Ni contents (5-65 mass percent) in acidic sulfate solutions was investigated. The effects of working conditions e.g. concentration of sulfate ions, immersion time and temperature were studied and discussed. In this respect, open-circuit potential measurements, polarization techniques and electrochemical impedance spectroscopy (EIS) were used. Potentiodynamic measurements revealed that the increase in the Ni content improves the stability of the Cu-Ni alloys. The polarization measurements were confirmed by EIS experiments. The stability of the alloys with higher Ni contents is due to the increased amount of Ni in the surface film. The corrosion process of the cupronickels in the acidic sulfate solution was found to be diffusion controlled. The experimental impedance data were fitted to theoretical data according to an equivalent circuit model representing the electrode/electrolyte interface.
机译:研究了不同Ni含量(5-65质量%)的Cu-Ni合金在酸性硫酸盐溶液中的电化学行为。工作条件的影响,例如研究和讨论了硫酸根离子的浓度,浸泡时间和温度。在这方面,使用了开路电势测量,极化技术和电化学阻抗谱(EIS)。电位动力学测量表明,Ni含量的增加改善了Cu-Ni合金的稳定性。通过EIS实验证实了偏振测量。 Ni含量较高的合金的稳定性归因于表面膜中Ni含量的增加。发现白铜在酸性硫酸盐溶液中的腐蚀过程是受扩散控制的。根据表示电极/电解质界面的等效电路模型,将实验阻抗数据拟合为理论数据。

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