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KOH post-etching-induced rough silicon nanowire array for H-2 gas sensing application

机译:用于H-2气敏应用的KOH后蚀刻诱导的粗糙硅纳米线阵列

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摘要

The limited surface area and compacted configuration of silicon nanowires (SiNWs), which are made by one-step metal-assisted chemical etching (MACE) go against target gas diffusion and adsorbtion for gas sensing application. To harvest suitable gas sensitivity and fast response-recovery characteristics, an aligned, rough SiNW array with loose configuration and high surface area was fabricated by a two-step etching process. The MACE technique was first employed to fabricate a smooth SiNW array, and then a KOH post-etching method was developed to roughen the NW surface further. The influence of the KOH post-etching time on the array density and surface roughness of the SiNWs was investigated, and the H-2-sensing properties of the sensor based on the as-fabricated rough SiNW array were evaluated systematically at room temperature. It was revealed that the post-etching of KOH roughens the NW surface effectively, and also decreases the wire diameter and array density considerably. The resulting configuration of the SiNW array with high active surface and loose geometry is favorable for gas sensing. Consequently, the rough SiNW array-based sensor exhibited a linear response to H-2 with a wide range of concentrations (50-10 000 ppm) at room temperature. Good stability and selectivity, satisfying response-recovery characteristics were also achieved. However, over-etching of SiNWs by KOH solution results in a considerable decrease in surface roughness and then in the H-2-sensing response of the NWs.
机译:通过一步金属辅助化学蚀刻(MACE)制成的硅纳米线(SiNW)的有限的表面积和紧凑的结构与目标气体的扩散和吸附相反,不利于气体传感应用。为了获得合适的气体敏感性和快速的响应恢复特性,通过两步刻蚀工艺制造了具有疏松配置和高表面积的对准,粗糙的SiNW阵列。首先采用MACE技术制造光滑的SiNW阵列,然后开发KOH后蚀刻方法进一步使NW表面变粗糙。研究了KOH后刻蚀时间对SiNWs阵列密度和表面粗糙度的影响,并在室温下系统评估了基于粗糙SiNW阵列的传感器的H-2-传感性能。揭示了KOH的后蚀刻有效地使NW表面变粗糙,并且还显着减小了线径和阵列密度。具有高活性表面和松散几何形状的所得SiNW阵列的配置有利于气体传感。因此,在室温下,基于SiNW阵列的粗糙传感器对H-2表现出线性响应,浓度范围很广(50-10 000 ppm)。还获得了良好的稳定性和选择性,并获得了令人满意的响应恢复特性。然而,通过KOH溶液对SiNWs的过度蚀刻会导致表面粗糙度的显着降低,进而导致NW的H-2感测响应。

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