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Low-current operations in 4F(2)-compatible Ta2O5-based complementary resistive switches

机译:在兼容4F(2)的Ta2O5的互补电阻开关中的低电流操作

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摘要

Complementary resistive switches (CRS), which consist of two anti-serially connected bipolar switching ReRAM cells, can reduce sneak path currents in passive crossbar arrays. However, the high operation current restrains the implementation of the CRS device. In this article, we present low current operation (< 300 mu A) of vertically stacked, 4F(2)-compatible Ta2O5-based CRS devices exhibiting two terminals. Two types of devices, either offering a nano-or a micrometer scale bottom cell (BC), are considered. The top cell (TC) in both configurations is designed of micrometer size. A novel three-step electroforming procedure for the vertical CRS device having no access to the middle electrode is exemplified and compared to the conventional forming procedure using three-terminal CRS devices. This three-step electroforming procedure provides adjustment of the maximum switching current in the nano-BC CRS: a low-level current compliance during forming enables low current CRS operation in subsequent switching cycles. Further, the nano-BC CRS shows the stable switching up to 104 cycles whereas the micro-BC CRS endures up to 106 cycles.
机译:互补电阻开关(CRS)由两个反串行连接的双极开关ReRAM单元组成,可以减少无源交叉开关阵列中的潜行电流。但是,高工作电流限制了CRS设备的实现。在本文中,我们介绍了具有两个端子的垂直堆叠,兼容4F(2)的Ta2O5基CRS器件的低电流操作(<300μA)。考虑了两种类型的设备,它们都提供纳米级或微米级的底部电池(BC)。两种配置中的顶部电池(TC)均设计为微米尺寸。举例说明了一种新型的三步电铸成型工艺,用于垂直CRS器件,该工艺无法接近中间电极,并且与使用三端子CRS器件的常规成型工艺进行了比较。此三步电铸过程可调节nano-BC CRS中的最大开关电流:在成型过程中的低电流顺应性可在后续开关周期中实现低电流CRS操作。此外,纳米BC CRS最多可显示104个周期的稳定切换,而微型BC CRS最多可显示106个周期。

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