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首页> 外文期刊>材料と環境 >A Study of the Mechanism of Intergranular Stress Corrosion Cracking of Alloy 600 in a High-Temperature Acid Solution
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A Study of the Mechanism of Intergranular Stress Corrosion Cracking of Alloy 600 in a High-Temperature Acid Solution

机译:高温酸溶液中600合金的晶间应力腐蚀开裂机理研究

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摘要

To clarify the acidic Intergranular Stress Corrosion Cracking (IGSCC) mechanism of alloy 600, some metallurgical factors were extracted from the various IGSCC contributing factors, and several kinds of experimental studies were conducted. Acidic IGSCC susceptibilities of mill-annealed, sensitized and thermally treated (TT) alloy 600 which have different grain boundary characteristics were examined using C-ring and SSRT tests. Grain boundary characteristics, such as chromium depletion, intergranular slipping behavior and electrochemical dissolution, were examined in detail using a modified Huey test, a Transmission Electron Microscope (TEM) study, and an electrochemical measurement, respectively. The C-ring and SSRT results showed that the IGSCC resistance of the sensitized material which had the chromium depletion zone was the least, and the TT material was the most resistant. TEM analysis showed that the slips at the grain boundary were easy to detect in the mill-annealed and sensitized materials. In the TI' materials, however, slips were suppressed by its intricate dislocation morphology. Electrochemical study showed that the preferential dissolution of nickel tended to occur with an increase in temperature and decrease in pH under the acidic condition. From these metallurgical and electrochemical test results, it was concluded that the slipping behavior and the nickel dissolution at the chromium depletion zone worked together as the influencing factor to acidic IGSCC.
机译:为弄清合金600的酸性晶间应力腐蚀开裂(IGSCC)机理,从各种IGSCC贡献因素中提取了一些冶金因素,并进行了多种实验研究。使用C形环和SSRT测试检查了具有不同晶界特性的轧制退火,敏化和热处理(TT)合金600的酸性IGSCC磁化率。分别使用改进的休伊试验,透射电子显微镜(TEM)研究和电化学测量,详细检查了晶界特征,例如铬耗竭,晶间滑移行为和电化学溶解。 C环和SSRT结果表明,具有铬耗尽区的敏化材料的IGSCC电阻最小,而TT材料的电阻最大。 TEM分析表明,在经退火和敏化处理的材料中,晶界处的滑移易于检测。然而,在TI'材料中,滑移被其错综复杂的位错形态所抑制。电化学研究表明,在酸性条件下,镍的优先溶解倾向于随着温度的升高和pH值的降低而发生。从这些冶金和电化学测试结果可以得出结论,滑移行为和镍在铬耗尽区的溶解是影响酸性IGSCC的因素。

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