A novel two-phase thermosyphon based on automotive technology is presented as a valid solution for the cooling of power-electronic semiconductor modules. A horizontal evaporator configuration is investigated. This solution is based on a 90 deg-shaped thermosyphon that allows an optimal geometrical arrangement of the cooler with limited volume occupancy, reduced air pressure drop, and weight as well as optimal thermal performance compared with standard heat-sink technology. The 90 deg-shape refers to the mutual arrangement of the evaporator body and the condenser, which are in a horizontal and vertical position, respectively. The evaporator cools three power modules with a total power loss between 500 and 1500 W. Experimental results are presented for inlet air temperatures ranging from 20 to 50℃ and for different air volume flow rates between 200 and 400 m~3/h. The working fluid is refrigerant R245fa. The maximum thermal resistance (cooler base to air) attained values between 40 and 50 K/kW.
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机译：提出了一种基于汽车技术的新型两相热虹吸管，作为冷却功率电子半导体模块的有效解决方案。研究了水平蒸发器的配置。该解决方案基于90度形状的热虹吸管，与标准的散热器技术相比，该热虹吸管可实现冷却器的最佳几何布置，并具有有限的容积占用，降低的空气压降和重量以及最佳的热性能。 90度的形状是指蒸发器主体和冷凝器的相互布置，它们分别处于水平和垂直位置。蒸发器冷却三个功率模块，总功率损失在500至1500 W之间。针对进气温度为20至50℃以及不同风量流量为200至400 m〜3 / h的情况，给出了实验结果。工作流体是制冷剂R245fa。最大热阻（冷却器对空气的热阻）达到40至50 K / kW。
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