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首页> 外文期刊>Journal of Low Power Electronics >Low-Power Heterogeneous Systems-on-Chips
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Low-Power Heterogeneous Systems-on-Chips

机译:低功率异构芯片系统

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摘要

The design of heterogeneous Systems-on-Chips (SoC) in very deep submicron technologies becomes a very complex task that has to bridge very high level system description with low-level considerations due to technology defaults and variations and increasing system and circuit complexity. This paper describes the major low-level issues, such as dynamic and static power consumption, temperature, technology variations, interconnect, DFM, reliability and yield, and their impact on high-level design, such as the design of multi-V{sub}(dd), fault-tolerant, redundant or adaptive chip architectures. Some multi-processor based SoC (MPSoC) cases are also presented in three domains in which heterogeneity is large: wireless sensor networks, vision sensors and mobile TV. These examples also highlight the heterogeneous nature and the increasing complexity at circuit-level, with the extension from CMOS-only SoCs towards MEMS-and-CMOS SoCs.
机译:在非常深的亚微米技术中,异构芯片系统(SoC)的设计成为一项非常复杂的任务,由于技术默认和变化以及系统和电路复杂性的提高,必须将非常高级的系统说明与低级注意事项联系起来。本文介绍了主要的底层问题,例如动态和静态功耗,温度,技术变化,互连,DFM,可靠性和良率,以及它们对高层设计的影响,例如多V {sub }(dd),容错,冗余或自适应芯片架构。一些基于多处理器的SoC(MPSoC)案例也体现在异构性很大的三个领域:无线传感器网络,视觉传感器和移动电视。这些示例还突出显示了异构特性以及电路级复杂性的增加,从仅CMOS SoC扩展到MEMS和CMOS SoC。

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