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Microbeam deformed by evaporative microdrop

机译:蒸发微滴使微束变形

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摘要

Deformation of microbeams including microcantilever (MCL), simply supported micro-beam (SSMB), clamped-simply supported microbeam (CSSMB), and clamped-clamped microbeam (CCMB) induced by evaporative microdrop is theoretically investigated. MCL will bend upwards while SSMB, CSSMB, and CCMB will bend downwards when there is a sessile microdrop on the top surface of the microbeam. The maximum deflection of MCL is proportional to the cube of the contact radius and sin 8, and the maximum deflections of SSMB, CSSMB, and CCMB are proportional to sin 6 and nearly proportional to the cube of the contact radius. During constant contact angle (CCA) evaporation, as the contact radius reduces, the maximum deflection will decrease greatly. While during constant contact radius (CCR) evaporation, as the contact angle decrease, the maximum deflection will increase when the contact angle is larger than 90°, while the maximum deflection will decrease when the contact angle is less than 90°. Some numerical examples are given to show how MCL, SSMB, CSSMB, and CCMB are deformed by evaporative microdrop and the numerical simulations agree well with the theory.
机译:从理论上研究了包括微悬臂梁(MCL),简单支撑微梁(SSMB),夹钳式简单支撑微梁(CSSMB)和夹钳式微束(CCMB)在内的微束的变形。当微束顶面上有固定的微滴时,MCL将向上弯曲,而SSMB,CSSMB和CCMB将向下弯曲。 MCL的最大挠度与接触半径和sin 8的立方成正比,而SSMB,CSSMB和CCMB的最大挠度与sin 6成正比,并且几乎与接触半径的立方成正比。在恒定的接触角(CCA)蒸发过程中,随着接触半径的减小,最大挠度将大大减小。在恒定接触半径(CCR)蒸发期间,随着接触角的减小,当接触角大于90°时,最大挠度将增大,而当接触角小于90°时,最大挠度将减小。给出了一些数值示例,以显示MCL,SSMB,CSSMB和CCMB如何通过蒸发微滴变形,并且数值模拟与理论相符。

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