In this paper, we introduce a mathematical model for estimating the use of defect inspection capacity. Until recently, the selection of lots to be inspected was only done at the beginning of the manufacturing process. With the introduction of dynamic controls on production tools, the selection of lots to be inspected is done according to the production state. Our problem focuses on the Wafer at Risk (W@R) on process tools. The W@R is the number of processed wafers between two control operations. The W@R depends on several factors such as the availability of measurable products, control limits, defect inspection capacity and defect inspection control plans of products. Our model aims at calculating the defect inspection capacity required for given values of the listed factors. Experimental results on actual factory data are presented and discussed.
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机译：在本文中，我们引入了一个数学模型来估计缺陷检查能力的使用。直到最近，要检查的批次的选择仅在制造过程的开始进行。通过在生产工具上引入动态控制，可以根据生产状态选择要检查的批次。我们的问题集中在过程工具上的晶圆风险（W @ R）。 W @ R是两次控制操作之间已处理晶圆的数量。 W @ R取决于几个因素，例如可测量产品的可用性，控制限制，缺陷检查能力和产品的缺陷检查控制计划。我们的模型旨在计算列出因素给定值所需的缺陷检查能力。介绍并讨论了实际工厂数据的实验结果。
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