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Application of epoxy resins in electronics and optoelectronics.part ii.ways of reduction of flammability of the resins used in electronic industry

机译:环氧树脂在电子和光电子学中的应用。第二部分减少电子工业中树脂的可燃性的方法

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摘要

Review of various methods of limitation of epoxy resins (EP),used for titled purpose,flammability is presented on the basis of wide literature data (up to 2004).Halogen containing flame-retardants have been discussed in details.The mechanisms of their actions were characterized as well as the methods of their use together with selected metal (mainly Sb) compounds.Flame-retardants based on phosphorus compounds,introduced later because of some disadvantages of halogen containing ones,were also presented.Phosphorus compounds used as EP curing agents [Formulas (I)-(VII)] as well as organic phosphorus derivatives built into EP [Formulas (XII),(XIII),(XV),(XVI),(XVIII)] were taken into consideration.Other methods of flammability limitation,among others Al(OH)_3 or Mg(OH)_2 used for this purpose,were presented.Toxicity of EP combustion products was discussed (Table 2).
机译:在广泛的文献资料(截止到2004年)的基础上,对用于限制用途,可燃性的各种环氧树脂限制方法进行了综述。对含卤素的阻燃剂进行了详细讨论。它们的作用机理表征了其特点以及与选择的金属(主要是Sb)化合物一起使用的方法。还提出了基于磷化合物的阻燃剂,由于含卤素阻燃剂的一些缺点而在后面介绍。磷化合物用作EP固化剂考虑了[式(I)-(VII)]以及EP中内置的有机磷衍生物[式(XII),(XIII),(XV),(XVI),(XVIII)]。其他可燃性方法局限性,其中包括为此目的使用的Al(OH)_3或Mg(OH)_2。讨论了EP燃烧产物的毒性(表2)。

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