机译:Identification of Boundary Condition for Thin Elastostatic Plate Bending Problems (2nd Report, Introduction of Boundary Relations using Influence Functions)
机译:Linear fracture mechanics analysis of interfacial delamination in LSI packages under temperature cyclic loading: 2nd report, the effects of material properties and package geometry factors
机译:Influence of the alloying time on the hardness and the electric resistivity of PCL/pure copper materials produced by the mechanical alloying process
机译:Influence of the Alloying Time on the Hardness and the Electric Resistivity of PCL/Pure Copper Materials Produced by the Mechanical Alloying Process
机译:Inelastic constitutive equations for modified 9Cr-Mo steel under nonisothermal cyclic deformation conditions: 1st report, cyclic deformation behavior and internal state variable under isothermal and nonisothermal conditions
机译:Inelastic Constitutive Equations for Modified 9Cr-1Mo Steel under Nonisothermal Cyclic Deformation Conditions (1st Report, Cyclic Deformation Behavior and Internal State Variable under Isothermal and Nonisothermal Conditions)
机译:Identification of Boundary Condition for Elastostatic Thin Plate Bending Problems (1st Report, BEM Analysis of Inverse Problems for Boundary Values)