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A dependency of emission efficiency of poly-silicon light-emitting device on avalanching current

机译:多晶硅发光器件的发射效率与雪崩电流的关系

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摘要

A novel polysilicon light emitting device (LED) was realized in a standard complementary metal oxide semiconductor (CMOS) process that is based on a p-n junction reverse bias configuration. This LED can emit visible light based on the reverse bias p-n junctions in the dark. The central emitting doped structure element of this LED is n(+)-p-n(+)-p-n(+) stacked layout, which is similar to two reverse bias p-n junctions and two forward bias p-n junctions connected in series. The device mechanism for the visible light emitting process is defined by means of an avalanche breakdown process that occurs between the highly doped n(+) region and the lightly doped p region in the reverse bias p-n junctions. By using hot carriers generated in avalanche process, the emission spectrum from the device exhibits a wide spectrum whose wavelength range is from 400 nm to 900 nm at an operating voltage of 16 V. We compare the designed light intensities at the different wavelengths in other to obtain the dependency of the light emission at various wavelengths under different currents conditions. From the experimental observations, and based on the calculation of the quantum efficiency and power conversion efficiencies as related to the light emission, we confirmed that this particular LED has a better efficiency than three-terminal gated diode. The silicon light source could find some applications in on-chip optical interconnect and in electro-optical conversions in future all-silicon integrated photonic circuitry.
机译:在基于p-n结反向偏置配置的标准互补金属氧化物半导体(CMOS)工艺中实现了新型多晶硅发光器件(LED)。该LED可在黑暗中基于反向偏置p-n结发出可见光。该LED的中心发射掺杂结构元素为n(+)-p-n(+)-p-n(+)堆叠布局,类似于串联连接的两个反向偏置p-n结和两个正向偏置p-n结。可见光发射过程的器件机制是通过雪崩击穿过程来定义的,该过程发生在反向偏置p-n结中的高掺杂n(+)区和轻掺杂p区之间。通过使用在雪崩过程中产生的热载流子,在16 V的工作电压下,该器件的发射光谱呈现出波长范围为400 nm至900 nm的宽光谱。我们将不同波长下的设计光强度与其他波长下的光强度进行比较。获得在不同电流条件下各种波长的发光的依赖性。从实验观察,并基于与发光相关的量子效率和功率转换效率的计算,我们证实了这种特殊的LED具有比三端子门控二极管更好的效率。硅光源可以在未来的全硅集成光子电路中在片上光学互连和电光转换中找到一些应用。

著录项

  • 来源
    《Optical Materials》 |2019年第2期|711-717|共7页
  • 作者单位

    UESTC, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    UESTC, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    UESTC, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Chongqing Optoelect Technol Res Inst CETC 44, Chongqing 400060, Peoples R China;

    Chongqing Optoelect Technol Res Inst CETC 44, Chongqing 400060, Peoples R China;

    Sichuan Solid State Circuit Res Inst CETC 24, Chongqing 400060, Peoples R China;

    Sichuan Solid State Circuit Res Inst CETC 24, Chongqing 400060, Peoples R China;

    Sichuan Solid State Circuit Res Inst CETC 24, Chongqing 400060, Peoples R China;

    Sichuan Solid State Circuit Res Inst CETC 24, Chongqing 400060, Peoples R China;

    Univ South Africa, Dept Elect Engn, ZA-0001 Pretoria, South Africa;

    Univ South Africa, Dept Elect Engn, ZA-0001 Pretoria, South Africa;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Polysilicon; Light sources; Emission efficiency; CMOS;

    机译:多晶硅;光源;发射效率;CMOS;

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