100 W chip attenuator targets high power RF and microwave

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100 W chip attenuator targets high power RF and microwave

机译：100 W芯片衰减器针对大功率RF和微波

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International Manufacturing Services, (IMS), has made available a high power 0.375- × 0.250-inch (0.953- × 0.635-cm) size aluminum nitride chip attenuator. Designated the VGX-3725WA, it features wraparound terminals for solder or epoxy attachment and will dissipate 100 W at a 100 ℃ baseplate temperature.

机译：国际制造服务（IMS）已提供尺寸为0.375-×0.250英寸（0.953-×0.635-cm）的高功率氮化铝芯片衰减器。指定为VGX-3725WA，它具有用于焊料或环氧树脂连接的环绕式端子，并且在100℃的基板温度下会耗散100W。

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《Microwave Engineering Europe》 |2009年第9期|49-49|共1页
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1. Durian chips drying using combined microwave techniques with step-down microwave power input [J] . Nathakaranakule Adisak, Paengkanya Suwit, Soponronnarit Somchart Food and Bioproducts Processing. Transactions of the Institution of Chemical Engineers, Part C . 2019,第期

机译：榴莲芯片使用组合微波技术进行降压微波功率输入
2. Modeling and simulations of high-power microwave devices using the CHIPIC code [J] . Zhou J., Iu D.G.L., Iao C.L. Journal of Plasma Physics . 2013,第1期

机译：使用CHIPIC代码对大功率微波设备进行建模和仿真
3. Color and hardness of durian chips irradiated by controlled low power microwave [J] . Chantana Suwanchote, Jariya Weerakul, Chitnarong Sirisathitkul, Food Science and Biotechnology . 2012,第6期

机译：受控低功率微波辐射的榴莲片的颜色和硬度
4. A study of microwave curing process for underfill used in flip chip packaging. part 2: 3D FEM simulation of microwave power distribution inside variable frequency microwave oven [C] . Sung Yi, Lie Liu, Chian Kerm Siu . 2001

机译：倒装芯片封装中底部填充剂的微波固化工艺研究。第2部分：变频微波炉内微波功率分布的3D有限元模拟
5. Microwave performance and fabrication of quilt packaging, a novel chip-to-chip interconnect technology. [D] . Kopp, David P. 2014

机译：微波性能和被子包装的制造，一种新颖的芯片到芯片互连技术。
6. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems [O] . Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, 2015

机译：用于无线供电的神经接口系统的薄膜柔性天线和硅CMOS整流器芯片的协同设计方法和晶圆级封装技术
7. Figure 4: (A) One conserved sequence, which occurs 79 times in 46,264 binding site peaks from the ChIP-seq data-set. The mutation profile of this conserved sequence is illustrated, where ’_ ’ indicates this base is unchanged; DEL indicates this base is lost; INS X indicates a new base X is inserted in front of this base. (B) Several repeated elements patterns are listed. (C) In the first column, the top five DNA motifs, mined by meme-chip tools (Machanick Bailey, 2011) are illustrated. The resemblant conserved sequences, found by the CFSP algorithm are listed in the second column. In the third column, the position-specific scoring matrices, which are transformed from mutational information are listed. The similarity between meme motif and resemblant conserved sequence with PSSM format was calculated via a stamp motif comparison tool (Mahony Benos, 2007). The E-values for the similarity of those pairs is displayed in the fourth column. (D) One motif is selected in each group clustered by gkmsvm descriptors, and the corresponding motif found by the CFSP algorithm is listed below. (E) There are additional datasets (File No: ENCFF100GRL, ENCFF616IRT, ENCFF870CER, Target: SREBF1) collected from https://www.encodeproject.org. The top two motifs are selected in each file using meme tools, and the corresponding motifs found by our algorithm are listed below. [O] . -1

机译：图4：（a）一种保守序列，其发生在芯片-SEQ数据集中的46,264个结合位点峰值中的79倍。说明了这种保守序列的突变分布，其中'_'表示该碱度不变; del表示此基础丢失; INS X表示新的基础X插入此基础前面。（b）列出了几种重复的元素模式。（c）在第一栏中，示出了由MEME芯片工具（Machanick＆Bailey，2011）开采的前五个DNA主题。由CFSP算法发现的相应保守序列列于第二列中。在第三列中，列出了从突变信息转换的特定位置的评分矩阵。 MEME主题与PSSM格式的相似性与PSSM格式之间的相似性通过邮票图章比较工具（Mahony＆Benos，2007）计算。这些对相似性的电子值显示在第四列中。（d）在由GKMSVM描述符聚集的每个组中选择了一个图案，下面列出了CFSP算法的相应主题。（e）从https://www.encodeproject.org收集的，有附加数据集（文件no：cernff100grl，cenf616irl，conf8.20cer，target：srebf1）。使用MEME工具在每个文件中选择前两个图案，并且我们的算法发现的相应主题如下所示。
8. Microwave Attenuators for Powers Up to 1,000 Watts. [R] . Carlin, H. J., Torgow, E. N. 1950

机译：微波衰减器可支持多达1000瓦。

100 W chip attenuator targets high power RF and microwave

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