Multi-layered transducer structures offer the potential of improved performance in terms of increased transmit sensitivity, greater bandwidth, and enhanced reception characteristics. Unfortunately, the successful design of such devices is often difficult, owing to the complex interaction between the active piezoelectric layers and passive intermediate interface layers. Furthermore, in many practical applications, the loading effects imposed by the electrical drive circuitry often limit the performance improvements that may be physically realized. This paper describes the development of a comprehensive, unidimensional modeling approach. This model may be employed to facilitate the analysis and subsequent optimization of laminated transducer assemblies. The devices currently under consideration include both piezoceramic and piezopolymer configurations, as well as alternative piezocomposite designs. The effects of varying bondline thickness and the introduction of passive interface layers are examined, as is the influence of the electrical load circuitry on overall system response. The ability to accurately predict the response of stacked piezoelectric structures is demonstrated through extensive comparison of experimental and theoretical responses. This paper concludes by highlighting the important role that modeling plays in the design, fabrication, and optimization of complex multi-layered transducer assemblies.
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