In this paper, we present and implement a novel procedure for the accurate simulation of the thermoelectric effects which determine micromachined structures' behavior. This approach is simple to discretize, with rapid numerical convergence properties, and it yields results which are in very good agreement with experimental observations. We employ this procedure in particular to calculate P/sub 1ATM//P/sub VAC/, where P/sub 1ATM/ (resp. A/sub VAC/) denotes heat conducted down the micromachined structure supporting arms at one atmosphere (resp. vacuum) when the device is at the same average temperature. We show that P/sub 1ATM//A/sub VAC/ may not be unity, as had been earlier assumed, but is independent of input current. Finally, for a special class of devices, an analytical formula is obtained for P/sub 1ATM//P/sub VAC/ in terms of device parameters, and this result is also compared with the numerical simulation results.
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机译:在本文中,我们提出并实现了一种新颖的程序,用于精确模拟确定微机械结构行为的热电效应。该方法易于离散化,具有快速的数值收敛特性,并且产生的结果与实验观察非常吻合。我们特别采用此程序来计算P / sub 1ATM // P / sub VAC /,其中P / sub 1ATM /(分别为A / sub VAC /)表示热量是在一个大气压下通过微机械结构支撑臂传导的。设备处于相同的平均温度时)。我们证明,P / sub 1ATM // A / sub VAC /可能不像先前所假定的那样统一,但与输入电流无关。最后,对于一类特殊的设备,根据设备参数获得了P / sub 1ATM // P / sub VAC /的解析公式,并将此结果与数值仿真结果进行了比较。
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