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Effect of iodine on the corrosion of Au-Al wire bonds

机译:碘对金铝键合线腐蚀的影响

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Corrosion study was performed on Au-Al wire bonds, thin layers of sputter deposited Au and Al, and Au-Al intermetallic nuggets. The test environment was iodine-vapour in air (1 mg/L) at 85 degrees C with varying relative humidity, and 500 mg/L of KI in water. GDOES, XRD, SEM EDS, wire bond shear, and electrochemical testing were used to characterize the samples. Failures of Au-Al wire bonds were found to be primarily attributed to the corrosion of Al via formation of Al iodides and consequent formation of Al oxides and/or hydroxides. Most susceptible to corrosion are Al metallization and Al rich intermetallic phases. (C) 2015 Elsevier Ltd. All rights reserved.
机译:对Au-Al焊线,溅射沉积的Au和Al的薄层以及Au-Al金属间熔核进行了腐蚀研究。测试环境为空气中的碘蒸气(1 mg / L),温度为85摄氏度,相对湿度变化,水中的KI为500 mg / L。使用GDOES,XRD,SEM EDS,引线键合剪切和电化学测试来表征样品。发现金-铝丝键合的失败主要归因于通过碘化铝的形成以及随后形成的铝氧化物和/或氢氧化物对铝的腐蚀。最容易腐蚀的是铝金属化和富铝金属间相。 (C)2015 Elsevier Ltd.保留所有权利。

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