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Laser Treatment as Sintering Process for Dispenser Printed Bismuth Telluride Based Paste

机译:激光处理作为分配器印刷的碲化铋基糊剂的烧结工艺

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摘要

Laser sintering as a thermal post treatment method for dispenser printed p- and n-type bismuth telluride based thermoelectric paste materials was investigated. A high-power fiber laser (600 W, 1064 nm) was used in combination with a scanning system to achieve high processing speed. A Design of Experiment (DoE) approach was used to identify the most relevant processing parameters. Printed layers were laser treated with different process parameters and the achieved sheet resistance, electrical conductivity, and Seebeck coefficient are compared to tube furnace processed reference specimen. For p-type material, electrical conductivity of 22 S/cm was achieved, compared to 15 S/cm in tube furnace process. For n-type material, conductivity achieved by laser process was much lower (7 S/cm) compared to 88 S/cm in furnace process. Also, Seebeck coefficient decreases during laser processing (40–70 µV/K and −110 µV/K) compared to the oven process (251 µV/K and −142 µV/K) for p- and n-type material. DoE did not yet deliver a set of optimum processing parameters, but supports doubts about the applicability of area specific laser energy density as a single parameter to optimize laser sintering process.
机译:研究了激光烧结作为分配器印刷的p型和n型碲化铋基热电膏材料的热后处理方法。高功率光纤激光器(600 W,1064 nm)与扫描系统结合使用,可实现较高的处理速度。实验设计(DoE)方法用于识别最相关的处理参数。用不同的工艺参数对印刷层进行激光处理,并将获得的薄层电阻,电导率和塞贝克系数与管式炉处理的参考样品进行比较。对于p型材料,电导率为22 S / cm,而管式炉工艺为15 S / cm。对于n型材料,相比于炉法中的88 S / cm,通过激光工艺获得的电导率要低得多(7 S / cm)。同样,与p型和n型材料的烘箱工艺(251 µV / K和-142 µV / K)相比,激光加工期间的塞贝克系数也会降低(40–70 µV / K和-110 µV / K)。美国能源部尚未提供一组最佳的加工参数,但支持对特定于区域的激光能量密度作为优化激光烧结工艺的单个参数的适用性表示怀疑。

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