引线框架电镀银工艺经验谈

摘要

The typical bath composition and operation conditions of degreasing,acid activating,neutralizing,flash copper plating,silver electroplating,cyanide cleaning,anti-epoxy-bleed-out treatment,and anti-tarnishing during silver electroplating on leadframes for production ofIC (integrated circuit) parts were presented.Some methods for reducing silver immersion and the application of shielding plate to electro-stripping of silver were introduced.Some problems that need attention during cyanide cleaning were pointed out.%给出了集成电路引线框架电镀银生产中去油、酸活化、中和、闪镀铜、电镀银、剥银、氰化清洗、防树脂溢出、防变色等工序的常用配方和工艺条件,介绍了几种防银置换的方法及屏蔽板在剥银中的应用,指出了氰化清洗时应注意的问题.