微连接是电子产品制造中的关键技术之一，它既是实现芯片设计性能的重要途径，又是制约封装结构发展的瓶颈。微连接技术决定了封装结构的可实行性和可靠性，而随着芯片集成度不断增加，封装结构的创新也成为推动微连接技术发展的重要动力。该文通过对微连接技术及电子封装结构发展历程的研究，探究二者之间的相互关联，并介绍了微连接的几种特点以及几种常见的芯片焊接技术和微电子焊接技术，最后对电子封装结构及微连接技术的未来发展趋势进行了展望。%Microjoining technology is one of the most important technologies in the production of electronic products. It is not only a important way to realize the performance of chip design, but also the bottleneck which restricts the development of the packaging structure. Microjoining technology determines the feasibility and reliability of packaging structure while the innovation of packaging structure also becomes the motive power of the development of microjoining. This passage tries to explore the relationship between them by studying microjoining technology and the history of packaging structure evolution. It also introduced several kinds of characteristics of common microjoining and chip welding technology and microelectronic welding technology. Finally it predicted the future development of electronic packaging structure and microjoining technology.
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