环氧树脂在半导体器件中的应用及发展

摘要

The application of epoxy resin for semiconductor, especially for the sealing of integrated circuit IC was introduced in this paper. The abroad development of improving epoxy resin and the synthesis of SiO2 used in plastic sealing material was reviewed also.%本文对环氧树脂在半导体，尤其是集成电路封装中的应用进行了介绍，同时对目前国外各种改性环氧树脂以及塑封料中所用二氧化硅的合成等方面的发展进行了简述。