热空气脉冲喷吹法拆卸废旧印刷电路板的试验

摘要

Dismantling of electronic components is of great significance in recycling waste printed circuit boards(WPCBs),as an essential part of waste printed circuit boards recycling process. In this paper,a pilot dismantling machine was described,using hot air as heat source to melt solders and as pulse-jet to separate electronic components from the base boards. Disassembly process parameters were studied using orthogonal experiment,and the optimum processing parameters were analyzed. The dismantling rate of small patch components and total dismantling rate decreased along with the increase of injection times;when the total intake air temperature was 240℃,heating time was 5 minutes,injection times was 10,the dismantling rate of slot,through-hole and big patch components was most of above 95%,the highest rate of dismantling small components was more than 80%,and the total dismantling rate was more than 85%. The optimal experimental parameters were as follows:inlet temperature 240℃,the heating time 5min,pulsed jet injection 10 times.%电子元器件的拆卸对于废旧印刷电路板（waste printed circuit boards，WPCBs）的资源化利用具有重要意义，是废旧印刷电路板回收利用必不可少的环节。文章利用热空气作为预热气源和脉冲喷吹气源，采用自主设计的WPCBs拆卸设备进行拆卸实验，运用正交试验方法研究了拆卸工艺参数对电路板拆卸率的影响，优化了工艺参数，并对影响原因进行了分析。实验结果表明：小贴片元器件拆卸率与元器件总拆卸率随喷吹次数增加先增大后减小；当进气温度为240℃、加热时间为5min、喷吹次数为10次时，插槽元器件、通孔元器件、大贴片元器件拆卸率大部分在95%以上，小贴片元器件拆卸率最高达80%以上，且元器件总拆卸率达85%以上。利用热空气作为预热气源和喷吹气源拆卸WPCBs的最优实验参数为：进气温度为240℃，加热时间为5min，喷吹次数为10次。