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Architecting on-chip interconnection network for future many-core chip-multiprocessors.

机译:为未来的多核芯片多处理器设计芯片上互连网络。

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摘要

The rapid process scaling trend of the silicon industry has provided the resources to concurrently execute multiple instruction sequences on the same chip, a capability conventionally only available with bulky and expensive parallel computers and distributed multiprocessors. A range of chips have emerged with simultaneous multi-tasking capability, and received a well-known name "chip-multiprocessors" (CMP) which emphasizes their connections with the much bulkier predecessors, conventional distributed multiprocessors. As possibly the only cost-effective approach to keep Moore's law alive, CMP architectures have received tremendous research and developments efforts further boosting their multi-tasking capabilities (increased number of computing units, improved shared cache architecture, better scheduling and power management, etc.). In particular, as a crucial part of the on-chip system, on-chip interconnection network has become a heated field that draws great research interests and yet presents numerous challenges.;The most critical challenges facing on-chip interconnection network researches are the large design space and the disparaging requirements imposed by different applications. Lacking standards and demanding high performance, most proposed on-chip interconnection network architectures adopt technologies transferred from off-chip interconnection networks developed for conventional multiprocessors. However, the constraints imposed by the on-chip environment and the even stringent demand of low latency and high throughput makes the on-chip interconnection network essentially different from the off-chip counterparts, and elicits innovative approaches to efficient on-chip network architectures.;In this thesis an extensive view of researches on on-chip interconnection networks is presented. In the first two chapters, preliminary knowledge about and recent work on on-chip interconnection network is reviewed. In the following chapters, our work on exploring and improving the design of on-chip interconnection networks is presented. Particularly, in Chapter 4 novel architectures that provide quality-of-service at the interconnect-level are presented, and in Chapter 3 emerging interconnect techniques are leveraged to further improve the efficiency of on-chip interconnection networks. The final chapter highlights the observations and the findings obtained from foregoing chapters, as well as discusses open issues in this field.
机译:硅行业的快速工艺扩展趋势已为在同一芯片上同时执行多个指令序列提供了资源,而该功能通常仅在笨重且昂贵的并行计算机和分布式多处理器中才能使用。已经出现了具有同时多任务处理能力的各种芯片,并获得了众所周知的名称“芯片多处理器”(CMP),该芯片强调了它们与体积更大的前身传统分布式多处理器的连接。 CMP架构可能是使摩尔定律保持有效的唯一经济有效的方法,它已经进行了巨大的研究和开发工作,进一步提高了其多任务处理能力(增加了计算单元的数量,改进了共享缓存架构,更好的调度和电源管理等)。 )。特别地,作为片上系统的关键部分,片上互连网络已经成为一个引起人们极大兴趣的热点领域,但是却提出了许多挑战。片上互连网络研究面临的最关键的挑战是大型的设计空间以及不同应用程序提出的贬低要求。由于缺乏标准和对高性能的要求,大多数提议的片上互连网络体系结构都采用了从为常规多处理器开发的片外互连网络转移来的技术。然而,片上环境所施加的约束以及对低延迟和高吞吐量的甚至更严格的要求,使得片上互连网络与片外互连本质上有所不同,并提出了有效的片上网络体系结构的创新方法。 ;本文对片上互连网络的研究进行了广泛的介绍。在前两章中,回顾了有关片上互连网络的初步知识和近期工作。在以下各章中,将介绍我们在探索和改进片上互连网络设计方面的工作。特别是,在第4章中介绍了在互连级别提供服务质量的新颖体系结构,在第3章中,新兴的互连技术被利用来进一步提高片上互连网络的效率。最后一章重点介绍了从前几章中获得的观察结果和发现,并讨论了该领域的未解决问题。

著录项

  • 作者

    Ouyang, Jin.;

  • 作者单位

    The Pennsylvania State University.;

  • 授予单位 The Pennsylvania State University.;
  • 学科 Engineering Computer.
  • 学位 Ph.D.
  • 年度 2012
  • 页码 154 p.
  • 总页数 154
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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