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Micromachined ultrasonic transducers with piezoelectric aluminum nitride thin films.

机译:具有压电氮化铝薄膜的微加工超声换能器。

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In this research, a laboratory prototype of micromachined ultrasonic transducer (MUT) has been designed and fabricated with the application of piezoelectric aluminum nitride (AlN) thin films. The fabrication process of MUT device, especially the deposition of AlN thin film, is compatible with a standard integrated circuits (IC) technology. Preliminary results have demonstrated the feasibility of AlN thin film applied in MUT for medical ultrasonic detection.; AlN thin film was grown on aluminum metal layer by plasma source molecular beam epitaxy (PSMBE) system. X-ray diffraction (XRD) shows the films exhibit a high c-axis texture for a thickness of 1.2 mum grown at a temperature of 450°C. For the AlN film of 1.20 mum, residual stress was a compressive stress of 883 Mpa, which reduced with increasing thickness of the film. Based on the fundamentals of vibration and piezoelectricity, MUT device including silicon resonator and AlN sandwich structure has been designed. A prototype of 8 x 8 devices on a 3&inches; silicon (100) wafer has been fabricated. A series of experiments were conducted to find the process flow and the optimum process parameters.; MUT devices were characterized by optical, electrical, and acoustic measurements. The measured resonant frequencies AlN MUT and PVDF MUT devices were larger than the calculated value in order of 5% to 12%. The ratios of the flexural frequencies to the fundamental frequency were much close to the MUT design model within a 3% error for AlN MUT devices. Resonant frequencies of AlN MUT devices were also verified by the reflection coefficient with a network analyzer and the electrical impedance with an impendence analyzer. Effective coupling factors of AlN MUT devices were determined to be 0.18 from the resonant frequency and the antiresonant frequency. Fractional bandwidth of an AlN MUT was 8.30% at the center frequency of 2.65 MHz. Pressure sensitivity was stable between 14 mV/MPa and 18 mV/MPa independent on the pressure intensity and the distance from the ultrasonic source to the AlN MUT device. Immersion measurement, device linear characteristics, and performance of AlN MUT device exhibit a great potential for the state-of-art ultrasonic camera.
机译:在这项研究中,已经设计并制造了利用压电氮化铝(AlN)薄膜的微机械超声换能器(MUT)的实验室原型。 MUT器件的制造过程,特别是AlN薄膜的沉积,与标准集成电路(IC)技术兼容。初步结果证明了将AlN薄膜应用于MUT进行医学超声检测的可行性。通过等离子体源分子束外延(PSMBE)系统在铝金属层上生长AlN薄膜。 X射线衍射(XRD)显示,在450℃的温度下生长的1.2微米厚度的薄膜具有高c轴织构。对于1.20微米的AlN膜,残余应力为883 Mpa的压应力,该应力随膜厚度的增加而减小。基于振动和压电的基本原理,设计了包括硅谐振器和AlN夹层结构的MUT器件。 3 x英寸的8 x 8设备原型;已经制造了硅(100)晶片。进行了一系列实验以找到工艺流程和最佳工艺参数。 MUT设备通过光学,电学和声学测量来表征。 AlN MUT和PVDF MUT器件的实测谐振频率比计算值大5%至12%。对于AlN MUT器件,挠曲频率与基频的比值非常接近MUT设计模型,误差为3%。还通过网络分析仪的反射系数和阻抗分析仪的电阻抗来验证AlN MUT器件的谐振频率。根据谐振频率和反谐振频率,确定AlN MUT器件的有效耦合系数为0.18。 AlN MUT的小部分带宽在2.65 MHz的中心频率下为8.30%。压力敏感度稳定在14 mV / MPa和18 mV / MPa之间,与压力强度以及从超声源到AlN MUT装置的距离无关。 AlN MUT设备的浸入度测量,设备线性特性和性能为最新型的超声波摄像机展现了巨大的潜力。

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